Accton says AI networking demand is rising as it expands capacity for optical products
Ubiqconn, AV sign pact to develop universal unmanned systems controller
Ubiqconn Technology and AeroVironment have agreed to jointly develop a next-generation universal controller, a move that could make unmanned systems easier to operate across borders and manufacturers. The plan targets defense, public safety, and emergency response users, where interoperability and reliability are becoming increasingly important worldwide.
5G upgrades, AIDC projects boost Taiwan telcos in May
Strong 5G upgrade momentum, Mother’s Day handset promotions, and a wave of enterprise ICT projects tied to AI data center buildouts and cloud computing infrastructure helped Taiwan’s three major telecom operators post solid results in May 2026. Chunghwa Telecom logged record-high revenue and EBITDA for the month of May, while Taiwan Mobile kept its lead in profitability with EPS of NT$0.50, and Far EasTone continued its growth in mobile services with the industry’s highest 5G penetration among monthly-plan users.
Silicon Labs expands India presence as smart infrastructure demand grows ahead of TI acquisition
Silicon Labs is deepening its presence in India through expanded research operations and a greater commercial focus on smart infrastructure applications, even as the US-based wireless chipmaker prepares for an acquisition by Texas Instruments.
AI server tracker: Taiwan’s AI server build chain widens as rack suppliers outpace peers
Taiwan AI infrastructure suppliers see broad sales gains in May
Taiwan’s AI infrastructure technology suppliers posted stronger sales in May, led by firms tied to artificial intelligence servers, data-center networking, optical communications, and advanced cooling. The figures suggest demand remains driven by the buildout of AI infrastructure, with higher power loads, faster interconnects, and more complex thermal systems boosting orders and product mix.
Google weighs Samsung’s role in next AI chip as TSMC capacity tightens
Boston Dynamics highlights diverse strategies in humanoid robotics amid Nvidia-Unitree collab
PCIM 2026: Accepting local component deficits for system-level benefits
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: willingly accepting a localized thermal performance deficit to ultimately achieve dominant system-level advantages.