AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
SK hynix scouts US memory fab sites as customers seek local supply
South Korea chip cluster could expand to nine fabs as SK plans new investment
China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands
Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger demand for domestically developed computing chips lifted sales of its high-end processors.
Alibaba Cloud’s 6-year evolution: five super data centers pivoting to AI compute
Alibaba Cloud’s Lingjun Zhenwu M890 supernode has officially gone live, with its initial commercial deployment in Ulanqab, Inner Mongolia—the same super data center launched six years ago. The site is now hosting next-generation AI supernode compute capabilities, bringing Alibaba Cloud’s “Five Super Data Centers” back into the spotlight as the company positions itself for the AI era.
South Korea’s memory-chip exports surge 277% as system chips slip
South Korea’s semiconductor export boom was heavily concentrated in memory in July. Memory-chip export value surged 276.9% year over year, while system semiconductor exports slipped 0.7%, as server demand and higher memory prices created a sharp split between the two segments.
Alibaba Cloud races ahead with Ulanqab AI infrastructure
Global PMX sees semiconductor demand driving growth through 2027 as product mix shifts
Global PMX said its semiconductor business is emerging as the main growth driver and is expected to continue expanding through 2027, while automotive sales remain steady and are expected to improve as the global auto market recovers. The company also said its workforce is still rising, reflecting stronger shipments from Vietnam and Zhejiang plants.
OCP APAC 2026: What if AI’s next efficiency breakthrough is simply moving less?
For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove more heat.