Samsung Electro-Mechanics disclosed on July 23 that it signed a KRW295.12 billion (US$200 million) supply contract with a major global company for multilayer ceramic capacitors used in artificial intelligence servers and data center systems.

Industrial PC (IPC) maker Advantech is deepening its collaboration with AMD, unveiling a next-generation AI and edge computing server platform at AMD Advancing AI 2026 that is powered by the latest AMD EPYC 9006 series processors. Through a full board-to-system product lineup, the company is extending AI applications from data centers to the edge.

AMD said the artificial intelligence boom is entering a new phase that will force a major redesign of data centers, as demand shifts from model training toward inference, AI agents, and physical AI. At its Advancing AI 2026 event, the company introduced new server, accelerator, and rack-scale products to power the next generation of AI infrastructure.

Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC’s long-running Arizona buildout has entered a new phase after five years of construction, with the company’s first 4nm fab now ramping production and contributing to profits. The second fab is set to enter equipment move-in in the fourth quarter of 2026, the third fab is scheduled for move-in in September 2027, and the fourth has already begun site preparation.