27 Apr
Latest News and Trends

Innolux enters leading tier of advanced packaging with new RDL and TGV technology

Innolux is expanding into the advanced semiconductor packaging sector, leveraging display technology as its core platform to accelerate integration with semiconductor and IoT technologies. Building on its strengths in Thin-Film Transistors (TFTs), the company continues to enhance hardware performance while aggressively deploying in Mini LED, Micro LED, and advanced semiconductor packaging. Through technological iteration and capacity optimization, it aims to strengthen its market competitiveness.

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26 Apr
Latest News and Trends

BMW’s color-changing car is no longer a concept — E Ink says it’s ready for mass production

E-paper manufacturer E Ink stated that the BMW iX3 Flow Edition equipped with E Ink Prism technology was officially released at the Auto China 2026. This represents a major breakthrough in automotive surface innovation technology. The BMW iX3 Flow Edition has become the world’s first vehicle to adopt E Ink Prism electronic paper technology and move toward mass production, marking a new stage in which electronic paper vehicle-body technology has officially transitioned from concept demonstrations to practical applications.

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26 Apr
Latest News and Trends

Nvidia and OpenAI both make US$20 billion bets on AI chip startups: what’s the common factor?

2026 has become a major year for IPO fundraising among leading AI players. At the end of 2025, Nvidia CEO Jensen Huang spent US$20 billion to acquire the IP and talent of AI chip startup Groq. In April 2026, The Information reported that OpenAI will purchase more than US$20 billion worth of chips from AI chip startup Cerebras. These two amounts are nearly identical; Nvidia for acquisition, OpenAI for procurement. Although seemingly isolated events, they are symmetrical moves.

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26 Apr
Latest News and Trends

BizLink expands optical interconnect push, sees uncertain CPO ramp timing

The artificial intelligence boom continues to drive demand for related hardware, particularly as server power delivery and high-speed data transmission requirements increase. Against this backdrop, BizLink has shifted its business mix toward high-performance computing and semiconductor applications, which now account for more than 50% of revenue, transforming the company from a traditional cable supplier into a provider of integrated power and high-speed connectivity solutions for AI data centers.

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