Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
MicroIP unveils AI drone and edge systems at Taiwan Expo USA
Solidigm weighs US IPO as AI storage demand lifts valuation
Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
US, China eye US$60 billion in tariff relief, but chips stay off the table
Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal
At Singapore’s Innovate Together 2026 conference on September 25, executives and researchers from A*STAR’s Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.
Blade Hydrogen Green Technology targets waste hydrogen power for AIDC
As electricity demand from AI data centers and the semiconductor industry climbs rapidly, Blade Hydrogen Green Technology is tapping industrial byproduct hydrogen and mixed-hydrogen fuel cell technology to turn waste hydrogen into power and support low-carbon electricity supplies for AI data centers (AIDCs) and other sites. The startup has expanded its fuel cell power equipment from 30kW to 150kW and has installed a cumulative 1.65MW of generating capacity in Taiwan.
Advantech’s North America expansion signals a deeper shift toward local manufacturing, services
Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed and assembled systems across industrial technology markets. The move reflects broader US reshoring efforts, tighter supply-chain requirements, and rising customer interest in regulatory compliance and resilience.