AI boom sends China and Taiwan’s PCB makers racing to HK for capital

Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed circuit boards (PCBs) into a more critical role in compute upgrades. As technical complexity and product prices rise together, PCBs are quickly redefining their value in the electronics supply chain.

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Solidigm weighs US IPO as AI storage demand lifts valuation

SK Hynix’s US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation of up to US$150 billion and a fundraising target of about US$15 billion. The move comes as AI data centers drive stronger demand for high-capacity enterprise SSDs, putting AI storage businesses in focus for capital markets.

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Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance computing (HPC) markets. Part of the funding reportedly comes from advance payments by Nvidia and other global technology companies. With Samsung Electro-Mechanics having already entered Nvidia’s NVSwitch and Groq 3 supply chains, the two companies’ cooperation is expected to extend from an existing supply relationship to dedicated capacity.

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Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

At Singapore’s Innovate Together 2026 conference on September 25, executives and researchers from A*STAR’s Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

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Blade Hydrogen Green Technology targets waste hydrogen power for AIDC

As electricity demand from AI data centers and the semiconductor industry climbs rapidly, Blade Hydrogen Green Technology is tapping industrial byproduct hydrogen and mixed-hydrogen fuel cell technology to turn waste hydrogen into power and support low-carbon electricity supplies for AI data centers (AIDCs) and other sites. The startup has expanded its fuel cell power equipment from 30kW to 150kW and has installed a cumulative 1.65MW of generating capacity in Taiwan.

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Advantech’s North America expansion signals a deeper shift toward local manufacturing, services

Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed and assembled systems across industrial technology markets. The move reflects broader US reshoring efforts, tighter supply-chain requirements, and rising customer interest in regulatory compliance and resilience.

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Column: Beyond Zero Trust – why AI supply chain resilience needs a plan B

Artificial intelligence is rapidly entering enterprise operations, blurring the lines between cybersecurity and supply chain management. In the AI era, Zero Trust is no longer only about who can access a system. Enterprises must also ask whom and what they depend on, how concentrated those dependencies are, and what happens when a critical link fails.

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