ASE ramps advanced packaging in Taiwan as SPIL scales central hub

ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern, central, and southern Taiwan, as well as in China and Malaysia. The company estimates that capital expenditure could reach US$6 billion in 2026, reflecting continued investment in equipment and facilities.

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Msscorps eyes annual growth with silicon photonics expansion

Msscorps held its year-end gathering on February 1, 2026, during which chairman Chi-Lun Liu highlighted the company’s two decades of deep expertise in semiconductor testing and analysis. Having established a global footprint across 12 facilities in Taiwan, China, the US, and Japan’s key semiconductor hubs, Msscorps has seen monthly revenues hit record highs since the second half of 2025, signaling the start of a new growth phase.

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LMOC ramps silicon photonics output with new MOCVD expansion plan

LandMark Optoelectronics Corporation (LMOC) reported strong fourth-quarter 2025 performance, driven by a sharp ramp in silicon photonics (SiPh) shipments, with all three profitability metrics rising sequentially. The company expects silicon photonics demand to remain robust, forecasting faster quarter-over-quarter revenue growth in the first quarter of 2026 than in the previous quarter. Shipments are set to sustain threefold growth, supported by planned capital spending of about NT$700 million (US$22.3 million) to expand capacity ahead of demand growth in the second half of 2027.

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