Demand for AI chips is expected to remain strong in 2026, keeping the spotlight firmly on persistent shortages of high-end glass fiber cloth—an essential material in advanced circuit boards and chip packaging.

South Korea’s Intellectual Property Office (KIPO) signed a new Memorandum of Understanding (MOU) on intellectual property cooperation with China’s National Intellectual Property Administration (CNIPA) during a China-South Korea leaders’ meeting in Beijing in January 2026. It was the third such agreement, following earlier MOUs in 2013 and 2021.

The automotive electronics industry is undergoing a structural transformation unlike any it has seen before. As artificial intelligence moves from the margins to the core of vehicle design, two of Taiwan’s lesser-known industrial champions—HCMF Group and Kinpo Electronics—are deepening a cross-industry partnership aimed at navigating the upheaval. Their strategy rests on two pillars: system integration and a “global-local” manufacturing footprint, designed to withstand volatility in an increasingly fragmented market.