27
Oct
Chinese mobile electronics manufacturers are expanding their footprint in India amid signs of easing tensions between the two countries, industry executives told the Economic Times. Despite thinner profit margins compared with local players, firms such as DBG and BYD are ramping up production and rehiring staff to meet growing demand from Chinese smartphone brands, including Xiaomi, Oppo, and Vivo.
27
Oct
Taiwan’s WeMo scales up smart mobility network, aims for 50,000 e-scooters by 2030
WeMo, Taiwan’s leading shared electric scooter platform, is set to celebrate its 10th anniversary in 2026. Over the past year, the company has forged partnerships with major industry players—including Taiwan Mobile, LINE GO, iPASS MONEY, and iRent—building a “cross-vehicle, cross-platform, cross-scenario” smart mobility ecosystem. WeMo also told DIGITIMES that it is targeting a cumulative fleet of 50,000 vehicles by 2030.
27
Oct
LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production of AI semiconductors, high-bandwidth memory (HBM), and related process equipment in South Korea, aiming to expand its business footprint.
27
Oct
Foxconn’s FIT to ramp up AirPods manufacturing, doubling Hyderabad workforce
Amid growing speculation over Apple’s deepening manufacturing push in India, Foxconn Interconnect Technology (FIT), a wholly owned subsidiary of the Taiwanese contract manufacturer, is preparing to significantly expand operations at its Hyderabad plant, according to people familiar with the matter cited by the Economic Times. The facility in Kongara Kalan, which began commercial production of Apple AirPods in April 2025, will reportedly double its output capacity and workforce over the next six to eight months.
27
Oct
Taiwan’s PCB makers enter ‘AI moment’ as complexity nears semiconductor levels
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles Shen stated that as heterogeneous integration becomes the trend in advanced packaging technology, the AI wave is creating a once-in-a-lifetime growth opportunity for the PCB industry. He emphasized that this will show the world that, in addition to semiconductors, Taiwan also possesses comprehensive capabilities in PCB technology.
27
Oct
Korea’s thinnest parking robot steals the show at FIX 2025
At the Future Innovation Technology Expo (FIX 2025) in Daegu, one of the busiest booths belongs to HL Robotics, whose live demonstration of its autonomous parking robot “PARKIE” has drawn steady crowds.
27
Oct
Reliance and Meta launch joint venture to build India’s enterprise AI future
Reliance Industries announced that its wholly owned subsidiary, Reliance Intelligence Ltd, has incorporated a new company, Reliance Enterprise Intelligence Ltd (REIL), as part of its strategic collaboration with Facebook Overseas Inc., a wholly owned subsidiary of Meta Platforms Inc. The incorporation took place on October 24, 2025, and forms a key step in advancing the joint venture (JV) between the two companies to develop enterprise-focused artificial intelligence (AI) solutions.
27
Oct
Xiaomi 17 series challenges Apple’s dominance in China’s high-end market
Xiaomi partner and president Weibing Lu is spearheading the company’s push into the premium smartphone segment, marking the Xiaomi 17 series in 2025 as a critical battle for the price tier above CNY6,000 (US$842.51). This range has long been dominated by Apple’s iPhone.
27
Oct
Intel warns of CPU shortages and price hikes as older nodes hit limits
Intel’s CFO Dave Zinsner revealed at the third quarter 2025 earnings call that strong chip demand has led to supply constraints, driven by data center operators urgently upgrading CPUs to keep pace with advanced AI chips. The company’s Intel 10 and Intel 7 process nodes are currently experiencing tight production capacity.
27
Oct
Topco accelerates overseas push to align with clients’ new fab investments
Geopolitical tensions are creating turbulence in global trade. According to TSMC founder Morris Chang, globalization is dead. Semiconductor material distributor Topco Scientific also reported sensing the trend toward localized supply chains.