As the global demand for AI accelerates, a new industrial challenge has emerged: the sheer scale of energy required to power the “AI factories” of the future. This concern was the centerpiece of presentations by several industry figures at Computex in Taipei, where they presented solutions under development, from raw material innovations to shrinking component sizes.

Foxconn announced on June 4 a strategic partnership with Intel to explore end-to-end AI solutions spanning chips, racks, systems, and applications, with cooperation covering AI rack infrastructure, edge AI, and physical AI platforms. The partnership will also extend to design services for custom ASICs, SoCs, and system integration, combining Intel’s processor, silicon photonics, and software ecosystem with Foxconn’s global manufacturing scale, system integration capabilities, and AI data center deployment experience.

Qualcomm recently outlined its vision for Wi-Fi 8, saying the next-generation standard is designed to improve overall reliability, lower latency, and expand coverage. The company said the shift from Wi-Fi 7 to Wi-Fi 8 reflects a broader end-to-end ecosystem approach, from infrastructure to the client side.

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions.