SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory.

Formosa Chemicals & Fibre Corp. announced plans to expand into high-value semiconductor and AI data center materials and will debut these businesses at COMPUTEX TAIPEI 2026. The company said it has shipped a high-RTI flame-retardant polycarbonate material for backup battery modules and cooling fans since 2025, is developing deep ultraviolet photoresist precursor materials, and is advancing a high-purity low-carbon hydrogen project to support semiconductor fabs.

BenQ is using Computex 2026 to signal a clear shift toward AI‑driven, workflow‑specific display technology, expanding its portfolio with solutions built for creators, engineers, educators, enterprises, and professional gamers. The company frames this evolution as part of a broader strategy to support how people think, create, and collaborate in an increasingly connected, AI‑accelerated world…