Silicon photonics (SiPh) chip designer BE Epitaxy Semiconductor turned profitable in 2025 as demand for 800G and 1.6T co-packaged optics (CPOs) heads toward explosive growth. Backed by orders and funding from AMD and MediaTek, the company is using a lean-asset model and ecosystem integration strategy to push into full-optical CPO design. General manager Jada Wang said 2026–2027 will mark the industry-wide breakout point for SiPh chips and CPO commercialization. BE Epitaxy Semiconductor’s 800G products have already reached shipment standards, and the company is now moving toward 1.6T optical engine (OE) chipsets.

Memory module maker Goldkey said it plans to raise NT$6 billion (US$191.4 million) to NT$10 billion in working capital in 2026 through multiple channels as tight supply and rising contract prices fuel a memory supercycle. The company also plans to accelerate a shift into higher-value segments such as industrial control, AI, and edge computing after posting a 30% gross margin and 27.4% operating margin in the first quarter of 2026.

Andrea Gallo, CEO of RISC-V International, used his appearance at the MIPS Forum during Computex 2026 to declare that RISC-V has completed its transition from academic project to industrial standard — and that its dominance in physical AI is no longer a future prediction but a present reality.

Innodisk announced a strategic partnership with Qualcomm and Formosa Plastics Group to launch an AI industrial safety vision solution that upgrades surveillance into intelligent video monitoring and decision-making tools. The collaboration combines Qualcomm Insight Platform AI imaging software, Innodisk’s edge AI servers and computing platforms, and Formosa Plastics’ field deployment and systems integration capabilities to deliver GenAI search and natural-language conversation features for industrial sites.