US president considers inviting Nvidia and other CEOs to China trade talks

CEOs from Nvidia and other American tech companies are among those that the US government plans to invite to join President Donald Trump’s visit to China next week. Along with the trade negotiations, the US leader has also sought to frame the summit as a type of high-level trade delegation, although the White House is reportedly considering inviting only a small number of executives.

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TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.

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