Leading Interconnect Semiconductor, a Zhen Ding Technology subsidiary, has broken ground on an AI advanced packaging substrate project in Bao’an, Shenzhen, with total investment expected to be at least CNY12 billion (approx. US$1.79 billion). The new site is designed to add four factories and expand the company’s ability to develop, manufacture, and deliver high-end flip-chip ball grid array (FCBGA) products for AI, high-performance computing (HPC), and advanced packaging customers.
Taiwan’s Ministry of Economic Affairs delayed a 2026 electricity rate decision on September 18 after the Middle East war pushed up fuel prices and raised Taiwan Power’s generation costs. The ministry said it would first seek NT$71.1 billion (approx. US$2.24 billion) in government funding, while the current tariff will stay in place through December 2026.
AI’s shift from data centers into cars, robots, wearables, and connected devices is widening the market for fully depleted silicon-on-insulator (FD-SOI), while China is building a domestic supply chain spanning substrates, foundry capacity, and chip design.
Tower Semiconductor plans to make Japan its largest manufacturing base for optical communications semiconductors after expanding silicon photonics (SiPh), silicon germanium (SiGe), and advanced packaging capacity in the Hokuriku region, as demand from AI data centers accelerates.
US-based First Solar, best known for thin-film solar production, plans to withdraw its Section 337 complaint under the Tariff Act of 1930 and resume patent lawsuits against rivals. Market observers say the company still wields significant firepower in the US TOPCon patent war.
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