Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.

Anduril Industries and Taiwan’s Metal Industries Research and Development Center signed a memorandum of understanding to deepen collaboration on unmanned aerial vehicle key technologies, executives announced during a recent visit that included a stop at Computex 2026. The agreement targets AI autonomous systems, drone manufacturing, supply-chain localization, and the construction of non-red supply chains to boost Taiwan’s international cooperation and global competitiveness in the drone sector.

LG Innotek is seeking to enter the supply chain for substrates used in Intel’s EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea.