Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics’ semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the next-generation high-bandwidth memory (HBM) supply chain is entering a final stage.

Market sources say analog chip design leader Texas Instruments (TI) is preparing to raise prices on a range of semiconductor products starting in April 2026. The scale of the increases across different product lines and the outcomes will depend on negotiations between TI and its customers.

Vivo unveiled its V70 series in Taiwan on the March 10, aiming to drive continued growth in its 2026 local operations by bringing flagship features to a broader audience. Although Taiwan’s smartphone market is expected to slow in 2025 due to high penetration rates and the price of components continues to rise, Vivo Taiwan President Yi-ting Chen said the company plans to boost revenue by 30% and increase shipment volume by 20% through targeted product segmentation and innovative marketing strategies.