As AI goes physical, the robotics supply chain reshuffles

As generative AI expands into physical environments, robotic systems are moving beyond traditional digital roles to interact with their surroundings physically through perception and action. This shift toward Physical AI, supported by Nvidia CEO Jensen Huang’s repeated public endorsements, is reviving global interest in robotics, an industry historically centered on industrial automation. Supply chain players are accelerating strategic efforts to capitalize on this renewed momentum amid an ongoing industry restructuring.

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AMD’s investment in photonics and modular architecture signals shift in AI infrastructure development

AMD is positioning itself to address the future needs of artificial intelligence (AI) computing through advances in chip design and system architecture, particularly by integrating photonics technology and modular rack-scale platforms. CTO Mark Papermaster, speaking in a recent interview, highlighted how AMD’s evolving engineering strategies will shape AI hardware capabilities and scalability over the next several years.

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Nvidia and Dassault Systèmes deepen partnership to bring AI into the physical world

Dassault Systèmes announced that it will undertake its largest-ever technology integration with Nvidia, deepening a partnership that spans more than 25 years. Under the expanded collaboration, the two companies will embed accelerated computing, generative artificial intelligence, and digital twin technologies throughout engineering design and manufacturing workflows, jointly positioning themselves at the forefront of Physical AI and so-called world foundation models.

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GlobalFoundries reinvent wafer services by integrating IP to meet evolving market demands

The traditional wafer foundry model is transforming as leading foundries increasingly incorporate intellectual property (IP) into mature technology nodes to address economic pressures and shifting customer needs. Nearly four decades after TSMC founder Morris Chang separated chip design from wafer manufacturing, foundries are evolving from mere silicon suppliers into broader infrastructure providers offering extended platform support.

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Next-gen Ku/Ka metasurface antenna to launch through JDI-Kymeta collab

Japan Display Inc. (JDI) has entered a strategic master supply agreement with Kymeta, a global leader in mobile satellite communications powered by metamaterials technology, to develop glass substrates for a next-generation multi-band metasurface antenna. The collaboration aims to create the industry’s first metasurface terminal capable of operating concurrently across Ku and Ka-band satellite frequencies.

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