21 Aug
Latest News and Trends

High-end PCB materials shortage looms as AI demand outpaces capacity

The artificial intelligence boom is driving sharp demand growth across the printed circuit board (PCB) materials chain, pushing both prices and volumes higher. Supply pressure is no longer limited to low-CTE fiberglass fabrics used in CoWoS substrates; shortages are now spreading to low-Dk fiberglass fabrics for copper-clad laminates (CCL), high-volume-low-profile (HVLP) copper foil, and coated microdrills required for PCB drilling.

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21 Aug
Latest News and Trends

MediaTek automotive platform integrates Google ecosystem, leveraging diverse technologies

MediaTek recently announced that it has become the first partner to provide Google’s Project Treble support specifically for the automotive ecosystem. The company will offer customers at least four years of firmware upgrades and software maintenance to enhance customer support, reduce the total cost of ownership, protect user data, and extend the lifecycle of automotive products.

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21 Aug
Latest News and Trends

Syntec Technology to list by September, expanding from machine tool controllers to robotics and smart manufacturing

Starting as a tool machine controller manufacturer, Syntec Technology has steadily expanded into robotics and smart manufacturing. Anticipating robust demand for smart manufacturing solutions, the company is set to officially list on the Taiwan Stock Exchange by the end of September 2025, marking an important milestone in its entry into capital markets.

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21 Aug
Latest News and Trends

Taiwan’s MPI grabs first-mover advantage in MEMS probe cards for AI chips

Taiwan’s MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip development and drive demand for advanced wafer probe cards. Starting in 2026, Google and Amazon Web Services (AWS) are expected to lead a surge in CoWoS advanced packaging capacity, powered by their in-house AI application-specific integrated circuits (ASICs). These chips have already progressed from 7nm to 5nm and 4nm, with the next wave targeting sub-3nm nodes.

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21 Aug
Latest News and Trends

Ainos unveils world’s first AI Nose module, digitizing smell for transformative industrial and medical applications

Artificial intelligence (AI) has already transformed how machines see and hear, and the next frontier is smell. US-based olfaction technology developer Ainos has introduced the world’s first commercial AI Nose module, featuring globally patented technology and a proprietary Smell Language Model (SLM) that enables machines to analyze odor with human-level precision.

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21 Aug
Latest News and Trends

Kenmec partners with Germany’s Neura Robotics to automate semiconductor back-end processes

Kenmec Mechanical Engineering has entered into an exclusive agency agreement with German humanoid robot startup Neura Robotics to enhance intelligent in-factory logistics, with an initial focus on automating semiconductor back-end processes. The partnership aims to provide automation solutions to address labor-intensive tasks in packaging and testing.

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21 Aug
Latest News and Trends

Nvidia’s impossible dilemma: trust on a string between Washington and Beijing

Nvidia’s H20 chips have unexpectedly emerged as a new flashpoint in the intensifying tech rivalry between the United States and China. Reports that Washington installs trackers on servers using Nvidia chips from Dell and Super Micro during shipment have fueled Beijing’s suspicions, deepening its long-standing distrust of American chip security.

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