Japan’s chip tool market to top JPY5 trillion in FY26 amid AI boom

The Japan Semiconductor Equipment Association (SEAJ) has updated its sales forecast for Japanese-made semiconductor manufacturing equipment over the next three fiscal years, projecting a steady increase reaching JPY5.51 trillion (US$38.35 billion) by fiscal 2027. The latest forecast sees modest growth driven primarily by investments in cutting-edge chip technologies and AI-related applications.

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With d-Mode GaN, Renesas seeks edge in high-power semiconductor market

Following its acquisition of US-based GaN pioneer Transphorm, Renesas Electronics is ramping up its ambitions in the wide-bandgap power semiconductor space. With a bold pivot away from the crowded fast-charging market for consumer electronics, Renesas is positioning its new generation of GaN products for higher-power applications, including electric vehicles, industrial automation, infrastructure, networking, and even AI servers.

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Tesla halts Optimus robot production plans as hardware woes mount

Tesla has reportedly paused procurement and production plans for its humanoid robot, Optimus, due to unresolved hardware challenges, according to sources within China’s supply chain network. The temporary suspension comes as Tesla’s engineering team works to refine key technical components. The company intends to resume procurement only after optimizing the robot’s design and confirming a revised mass production schedule.

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South Korea’s 3D printing boom sparks fears of tech leaks to China

Many South Korean companies are turning to 3D printing to cut production costs, using the technology to manufacture products in critical sectors such as aerospace and defense, areas classified as national core technologies. However, some cases involve the use of Chinese-made 3D printers or subcontractors leaking proprietary technologies to China. Critics argue that South Korea’s current registration-based system for operating 3D printing businesses lacks sufficient oversight, leaving the industry vulnerable to security breaches and intellectual property theft.

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Huawei’s semiconductor matriarch charges forward with dual front: chips and talent

As US-China tech tensions intensify, Huawei is accelerating efforts to achieve technological independence after being added to the US Entity List in 2019. He Tingbo, president of HiSilicon and a central figure in Huawei’s semiconductor strategy, is stepping into a pivotal role. She has been appointed head of Huawei’s Senior Talent Compensation Division, expanding her authority over executive pay and talent development, key pillars in the company’s long-term innovation agenda.

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Component makers across Southeast Asia await clarity as Vietnam reaches tariff deal with US

US President Donald Trump has unveiled a trade agreement with Vietnam that reduces tariffs on Vietnamese exports to the US from 46% to 20%, while imposing a 40% levy on transshipped goods. Although the full policy details have yet to be released, connector and cable suppliers say the Vietnam deal provides a provisional reference point amid broader uncertainty over regional tariff policies.

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