E Ink and Netronix power ahead as E-paper demand surges across segments

With customers pulling in orders ahead of schedule, E Ink Holdings expects the second quarter of 2025 to be its strongest second quarter on record — traditionally, its peak performance has come in the third or fourth quarters. The company remains optimistic about the third quarter while the fourth quarter will depend in part on clarity around global tariff policies. Nevertheless, E Ink has dubbed 2025 the “first year of large-format e-paper,” with digital signage projected to become its largest revenue stream in the near future.

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China-based USI moves upmarket with L10 edge AI server for global clients

Universal Scientific Industrial Shanghai (USI), a China-based electronics design and manufacturing company, has completed delivery of a Level 10 (L10) full-system joint design manufacturing (JDM) project. The lightweight edge AI server, co-developed with a major international client, targets deployment in healthcare, retail, and industrial applications across Europe and North America.

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Malaysia-Singapore Special Economic Zone builds cross-border AI ecosystem amid sovereign tech race

As the global race to build “sovereign AI” gains momentum, Southeast Asia is carving out a strategic role in the next wave of digital infrastructure, and the Johor-Singapore Special Economic Zone (JS-SEZ) is emerging as a focal point. High-profile moves, like Nvidia CEO Jensen Huang’s recent visit to the Middle East, have spotlighted the growing link between AI innovation and national policy. In Southeast Asia, JS SEZ is becoming a real-world testbed for how governments can work together to support AI-powered industries.

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SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience

SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key highlight will be the official launch of the SEMI 3DIC Advanced Manufacturing Alliance (SEMI 3DICAMA) on September 9, which will delve into critical topics such as breakthroughs in advanced packaging technologies for AI chips.

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