Black Sesame, Horizon Robotics unveil China’s smart driving chip race

China’s intelligent driving market continues to surge, with Black Sesame Technologies and Horizon Robotics both reporting solid top-line revenue growth for the first half of 2026. Highlighting the rapid commercialization curve, Horizon Robotics announced on September 3 that cumulative mass production of its Journey series smart driving processors surpassed 15 million units—signaling that competition in China’s automotive IC sector is shifting from raw computing battles to large-scale mass deployment and market penetration.

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Analysis: Taiwan manufacturers face a deeper labor squeeze as AI boom pulls workers away

Taiwan’s traditional manufacturers are warning that the island’s growth story is widening a long-running labor gap, as semiconductor and AI server demand lifts the economy even as factories struggle to hire and retain skilled workers. In the auto supply chain, where smart vehicle electronics are increasingly essential, companies say the workforce shortage is becoming a structural risk.

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Acer India tablet deal points to deeper push in Asia-Pacific

Acer has landed a nearly US$200 million tablet order from the state of Uttar Pradesh in India, underscoring the company’s growing public-sector business in one of its fastest-expanding markets. Acer Pan-Asia Pacific operations president Andrew Hou said India revenue exceeded US$700 million in 2025 and could top US$800 million in 2026 as the company moves closer to a US$1 billion revenue target.

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How UC Santa Cruz’s Silicon Valley lab is reverse-engineering the human brain to solve AI’s chip power crisis

As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to biological neuroscience to build an entirely new class of energy-efficient microelectronics. Their objective is straightforward but radical: reverse-engineer the human brain to solve the semiconductor industry’s looming power and thermal bottlenecks.

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