Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI

As the artificial intelligence revolution outgrows the digital cloud and demands physical form, a major structural transition is quietly reshaping Silicon Valley. While the region has long been celebrated as the world’s epicenter for software and venture capital, the massive compute, cooling, and mechanical requirements of robotics and physical AI are pulling tech’s center of gravity back to heavy industrial hardware.

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South Korea secures US$2B from Air Products, Axcelis, Corning, Pacifico Energy to bolster supply chains

Four major US technology companies have committed a combined US$2 billion to investments across South Korea’s semiconductor materials, equipment, and clean energy sectors. The move is expected to reinforce critical supply chain resilience between the US and South Korea while providing momentum for the South Korean government’s three strategic “Mega Projects.”

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Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company’s new Dresden fab is ramping at twice the pace of prior expansions, boosted by AI tools and a single virtual fab strategy. He said the facility could reach full capacity in two to three years as demand from the market and from AI takes off.

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India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it

India’s most senior semiconductor policymakers came to Taipei with an argument aimed squarely at the Taiwanese supply chain: the country’s chip program is meant to add redundancy to an over-concentrated global industry, not to substitute imports behind a wall. For Taiwanese materials, gas, equipment and packaging firms, that reframes India from a distant end market into a second production base their own customers are already asking them to staff.

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SEMICON Taiwan 2027 moves to August, aligning with TSMC’s 40th anniversary

SEMICON Taiwan, one of Taiwan’s key semiconductor industry events, will move its 2027 edition forward by nearly a month to August 18-20, departing from its traditional early-to-mid-September schedule. The rapidly expanding exhibition, whose agenda increasingly centers on TSMC’s strategy and technology roadmap, has grown substantially in recent years, but the new timing has raised concerns among some international supply-chain companies over summer holidays, Taiwan’s heat, and peak typhoon season.

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