JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity across high-performance computing (HPC), power modules, wafer-level packaging and memory, sharpening its exposure to AI infrastructure and China’s domestic semiconductor supply chain.

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading into mature and specialty processes, lifting wafer prices, utilisation and downstream chip costs.