The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks in the global supply chain for advanced packaging substrates, South Korea’s Samsung Electro-Mechanics (Semco) has proactively restructured its product lineup and increased prices. This move reflects not only rising raw material costs but also a structural shift where demand far exceeds supply.

Nanya Technology Corporation (NTC) reported March 2026 revenue of NT$18.17 billion (approx. US$568.15 million), up 16.42% month-over-month and 560.04% year-over-year. First-quarter revenue climbed to NT$49.09 billion, surging 582.91% to a record high, underscoring a sharp rebound in the DRAM cycle.

Amazon is in advanced discussions to acquire the satellite communications provider Globalstar, a move that could significantly strengthen its ambitions in low-Earth orbit broadband and sharpen its challenge to SpaceX and its dominant Starlink network, according to people familiar with the negotiations.

Taiwanese foundry Powerchip Semiconductor Manufacturing Corp. (PSMC) and France’s CEA-Leti have signed a multi-year agreement on April 3 aimed at easing one of artificial intelligence’s most pressing constraints: rising power consumption and data-transfer bottlenecks inside data centers, executives said in an interview with DIGITIMES Asia.