AI is driving force behind ‘Moore’s Law on steroids,’ says Merck’s Benjamin Hein

AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics Business Sector at Merck. As AI becomes an integral part of semiconductor innovation, future competitive advantages in the industry will depend less on any single process or material, but rather on the ability to combine materials, processes, packaging, metrology, and software into complete processes. In this sense, AI-driven growth in the semiconductor industry is like “Moore’s Law on steroids,” and collaboration will become the industry’s next Moore’s Law.

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Machine builders flood SEMICON 2026 to grow local chip tools

Taiwan’s machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the Taiwan Association of Machinery Industry (TAMI) calls for broader industry upgrading. The association voiced that appeal at a forum on September 3, saying Taiwan should leverage its semiconductor strength to lift traditional industries and continue nurturing a homegrown semiconductor equipment supply chain without relying on overseas sources.

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India roundup: India expands chip ambitions with full Semicon 2.0 notification

India’s technology sector is gaining momentum across semiconductors, connectivity, AI payments, PCs, tablets and refurbished smartphones, as policy support and local manufacturing attract investment. However, supply-chain diversification, margin pressure, cautious demand and VinFast’s manufacturing pause highlight challenges facing India’s broader technology ambitions.

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Acer hedges memory price shock with local AI, diversification

Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds to raise funds. He said Acer has already issued bonds worth NT$20 billion (US$630.7 million), adding that “Taiwan’s money” is not only benefiting the local market but is spreading around the world.

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BenQ Materials targets CPO in semiconductor push

BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move into wafer manufacturing, back-end packaging, and co-packaged optics (CPO). With chemical mechanical planarization (CMP) cleaning brush rollers and wafer dicing tape already shipping, the group views 2026 as a new starting point for its semiconductor business, with more visible growth expected from 2027.

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Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across the broader semiconductor equipment supply chain. Highlighting the trend at SEMICON Taiwan 2026, Hiwin Mikrosystem, in collaboration with the Hiwin Group, unveiled its next-generation precision positioning platform for SiPh inspection. Spurred by accelerating market adoption, order visibility for the platform now extends into the second quarter of 2027.

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