24
Jul
Agentic AI is spreading rapidly across personal computers and enterprise endpoints, prompting AMD to expand its local AI strategy with a new platform capable of running significantly larger models on-device.
24
Jul
Rapidus expands Hokkaido chip hub with packaging and analysis
Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis and advanced packaging capabilities alongside a front-end pilot line for 2nm logic chips.
24
Jul
Wistron says growth is strong, but transformation remains incomplete
Wistron said its revenue and profit continue to rise, and its global manufacturing platform is opening new growth avenues for readers watching the electronics, AI, and industrial supply chains. The Taiwan-based company is pushing into higher-margin businesses while demand remains strong across key markets worldwide.
24
Jul
Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp
SemiAnalysis recently forecast that large-scale deployment of Nvidia’s native single-ended 800V high-voltage direct current power architecture could slip from the market’s previous expectation of 2027 to beyond 2028, raising concerns over growth prospects for the AI power supply chain.
24
Jul
Chinese AI labs close gap with Anthropic after Claude Code leak
A springtime source-code exposure reframed the AI race around “harness” and memory engineering rather than raw model scale — and a wave of Chinese models built around exactly those ideas has since arrived within striking distance of Anthropic’s flagship.
24
Jul
Kimi K3 under fire, part 3: China’s AI industry questions success story
Chinese officials have embraced Kimi K3 as evidence of indigenous innovation and a maturing open-model ecosystem. Some Chinese developers and technology commentators are far less convinced.
24
Jul
Realme exits China smartphone market, Oppo hands domestic focus to OnePlus
Realme has stopped producing smartphones for China and will launch no new models there, ending its domestic expansion as parent company Oppo consolidates overlapping brands and redirects resources overseas.
24
Jul
China’s AI chip share tops 50%, but Nvidia still rules frontier training
China’s AI infrastructure build-out is rapidly lifting demand for domestic accelerators, giving Huawei, Alibaba’s T-Head Semiconductor, Cambricon and Hygon a larger role in a market once dominated by Nvidia.
24
Jul
Samsung to break ground on Onyang HBM expansion in October, targets 2029 production
Samsung Electronics plans to break ground in October 2026 on a KRW 1.3 trillion (approx. US$884 million) expansion of its Onyang semiconductor packaging site in South Korea, targeting high-bandwidth memory (HBM) mass production in May 2029.
24
Jul
OpenAI compute spending to reportedly rise from US$600B to US$750B
OpenAI has increased its projected spending on compute from US$600 billion to US$750 billion by 2030. The 25% increase is meant to give its models an edge during a time of intense competition for compute power, although some worry about that the start-up’s investments are oversized.