Powerchip DRAM foundry price hike to boost June revenue; IPD to drive Intel demand in 2H27

Powerchip Semiconductor Manufacturing (PSMC) held an earnings call on April 21 to address developments in memory and logic foundry services, as well as its future business outlook. PSMC president Martin Chu stated that DRAM foundry prices had significantly increased in March. However, due to the impact of the tape-out cycle on pricing, the price hike is expected to contribute to revenue starting in June.

Continue reading

AI optical communication and automotive demand boost TXC, Taitien quartz component sales in 1Q26

Benefiting from strong AI high-frequency, high-speed transmission and communications infrastructure demand, TXC reported robust AI optical communication orders in the first quarter of 2026, driving its highest-ever quarterly revenue. The company’s March 2026 revenue reached NT$1.1 billion (approx. US$35.3 million), up 2.7% year-over-year; cumulative revenue for the first three months of 2026 hit NT$3.3 billion, a 5.5% annual increase and a record for this period.

Continue reading

Commentary: Apple eyes iPhone camera, Vision Pro, and CarPlay advances with new CEO in charge

Apple has officially confirmed long-rumored news that Tim Cook will step down as CEO in September 2026, handing over leadership of the US$4 trillion tech giant to senior vice president of hardware engineering John Ternus. Unlike Cook, known for his supply chain mastery, Ternus is well-known as a pure “product person” and engineer.

Continue reading

Analysis: Apple’s new CEO has a secret robot team — and big plans for your home

Apple has officially announced that John Ternus will succeed Tim Cook as CEO. Given Ternus’s deep hardware background, product innovation at the hardware level is widely expected to accelerate under his leadership. As AI development enters the era of embodied intelligence, his prior takeover of Apple’s secret robotics team is seen as pivotal to whether Apple can seamlessly integrate its existing AI technologies and software ecosystem with physical hardware.

Continue reading

Column: US drone industry learns from Ukraine’s low-cost, rapid production

“The drone is not the weapon. The infrastructure to build it is.” This statement, made by Ukrainian president Volodymyr Zelenskyy on March 31, 2026, encapsulates the direction of recent US policy reforms as America strives to establish a large-scale, low-cost, and fast-iterating drone industry similar to Ukraine’s. The US aims to simultaneously develop military and commercial markets while eliminating reliance on Chinese supply chains and catching up with China’s small- and medium-sized drone manufacturing capabilities.

Continue reading

Commentary: Apple’s succession play sees engineering credibility meet commercial legacy

Every major tech transition has exposed a different kind of leadership. The PC era rewarded visionaries. The mobile era rewarded operators. The AI era, Apple is betting, will reward engineers. That is the real logic behind elevating John Ternus — not just a changing of the guard, but a calculated repositioning of what Apple believes will matter most in the decade ahead.

Continue reading

How MediaTek will supply Marvell’s next three generations of TPUs

Recent market reports indicate that Marvell is in discussions with Google regarding the development of application-specific integrated circuit (ASIC) products, including memory processing units (MPUs) to pair with existing TPU products, as well as TPU chips for AI inference. Naturally, this brings some competitive pressure to Broadcom and MediaTek, which are currently in Google’s TPU supply chain.

Continue reading

Applied Materials announces Advantest as innovation partner for EPIC platform in Silicon Valley

Leading materials engineering in the semiconductor industry, Applied Materials, announced today that Advantest Corporation, a leading semiconductor test equipment supplier, will join Applied’s Equipment and Process Innovation and Commercialization (EPIC) platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.

Continue reading