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04 Sep

South Korea taps chip windfall for next tech push

September 4, 2026
By jeff

South Korea is turning a semiconductor-driven tax windfall into a broader technology investment push, directing record fiscal firepower toward chips, Nvidia’s Vera Rubin computing platform, AI data centers, robotics and the power and water infrastructure needed to support them.

04 Sep

Latest News and Trends

Samsung turns to chips, OLED for next phase of Vietnam expansion

September 4, 2026
By jeff

Samsung is expanding its Vietnam footprint beyond smartphones, with semiconductor testing, high-end chip substrates, OLED displays and R&D emerging as the next pillars of its presence in one of its largest global manufacturing bases.

04 Sep

Latest News and Trends

MSScorps August revenue hits new high on silicon photonics gains

September 4, 2026
By jeff

MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies, high-performance computing (HPC), advanced packaging, and high-speed optical interconnects, further raising the importance of semiconductor analysis services.

04 Sep

Latest News and Trends

Trusval Technology eyes NT$23 billion order backlog, US 4Q26 ramp

September 4, 2026
By jeff

Trusval Technology is riding AI- and high-performance computing-driven semiconductor expansion overseas, but Taiwan’s fab engineering firms face tougher labor shortages, regulations, materials constraints and rising costs abroad. Co-CEO Chu-chiao Kung said the company is turning years of high-spec project execution for leading advanced-process customers into global competitiveness.

04 Sep

Latest News and Trends

SEMICON Taiwan 2026: QuantumDiamonds cracks the hybrid bonding blind spot with new inline metrology

September 4, 2026
By jeff

TAIPEI, Taiwan — The global semiconductor industry is hitting a physical wall. As artificial intelligence demands push architectures toward three-dimensional packaging, high-bandwidth memory (HBM) stacks, and complex hybrid bonding, traditional inspection tools are going blind.

04 Sep

Latest News and Trends

G20 approves guidelines calling for more business-friendly AI regulation

September 4, 2026
By jeff

Delegates to the G20 summit have agreed to support proposed guidelines for a light touch on AI regulation. The framework, proposed by the US, appeared to show a rare moment of consensus as countries race to gain a foothold in the booming AI industry, all while grappling with how to strike a balance between encouraging innovation and preventing harm.

04 Sep

Latest News and Trends

Chunghwa Precision Test sees ASIC revenue overtaking GPU by 2027

September 4, 2026
By jeff

Chunghwa Precision Test Technology said demand for AI and high-performance computing (HPC) is driving a surge in advanced testing interface business, while ASIC revenue is set to grow rapidly and catch up with GPU sales. CEO Shui-Ke Huang said GPU products remain the mainstream in the HPC chip market and the company’s main revenue source, with US customers also serving as its largest clients.

04 Sep

Latest News and Trends

Lite-On makes US$170 million strategic investment in DCX for AI cooling push

September 4, 2026
By jeff

Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately a 25% stake in DCX upon completion, with a total transaction value of roughly US$176 million.

04 Sep

Latest News and Trends

India tablet market grows as business demand shifts toward premium devices

September 4, 2026
By jeff

India’s tablet market posted modest growth in the second quarter of 2026, a sign that enterprise demand and higher-spec devices are gaining importance for buyers worldwide. The shift toward detachable and productivity-focused tablets suggests vendors are adapting to rising costs, changing purchase patterns, and broader demand for more versatile computing options.

04 Sep

Latest News and Trends

K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap

September 4, 2026
By jeff

Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment and driving shipments to a record high, while the company continues to expand its advanced packaging business.

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