SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ahead of domestic rival Samsung Electronics in the race to supply AI-optimized memory solutions, according to reports by The Korea Economic Daily and Hankyung.

Optical mold manufacturer JMO Corp convened its annual shareholder meeting on June 19, where Chairman Rong-jhou Li and GM Jhih-cheng Syu offered an exclusive interview to DIGITIMES, shedding light on the company’s manufacturing progress in Thailand and its expanding footprint in AR glasses.

Huawei’s next-generation chip ambitions are running into technical and geopolitical headwinds. While Chinese state media CCTV recently claimed a breakthrough in 5nm production through foundry partner SMIC, the new MateBook Fold still ships with the 7nm Kirin X90. TechInsights, via Wccftech, confirms the chip is built on SMIC’s N+2 node — identical to the Kirin 9020 — falling short of the 5 nm-class N+3 process. The findings cast doubt on Huawei’s progress and suggest mass-market deployment of 5nm chips remains at least a year away.

Ability Opto-Electronics Technology (AOET) held its annual shareholder meeting on June 20, led by Chairman Victor Kao. He voiced cautious optimism for the second half of 2025, citing historical trends of stronger second-half performance and the company’s goal of exceeding 2024 results. Still, he acknowledged ongoing macroeconomic challenges dragging on global demand.