As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation advanced packaging, is gaining momentum. South Korean companies such as Samsung Electro-Mechanics (SEMCO) and LG Innotek are gearing up to compete for leadership in this emerging segment.

Intel’s 18A process node has reportedly drawn interest from Nvidia, though the chipmaker has yet to commit to using the technology, according to Reuters, citing sources familiar with the matter. The potential collaboration has not progressed, leaving the future of Intel’s 18A node in question.

As AI workloads intensify and data centre architectures evolve, optical communications vendors are positioning co-packaged optics (CPO) and silicon photonics (SiPh) as core mid- to long-term growth markets. LuxNet expects 800G products to surpass 400G as the market mainstream in 2026, with 1.6T products entering initial shipments and supporting growth over the next two to three years. TrueLight is moving into the AI high-performance computing (HPC) supply chain via continuous-wave (CW) laser foundry services and expects the foundry revenue share in 2026 to exceed 2025 levels.