华为徐直军：全球最强超节点今年四季度上市
9月18日消息，华为轮值董事长徐直军表示，超节点成为AI基础设施建设新常态，目前CloudMatrix 384超节点累计部署300+套，服务20+客户。
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Sep
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Sep
华勤技术递交港股上市申请
9月16日晚，华勤技术股份有限公司（以下简称“华勤技术”）发布公告称，公司已向香港联合交易所有限公司（以下简称“香港联交所”）递交了发行境外上市股份（H股）并在香港联交所主板挂牌上市的申请，并于同日在香港联交所网站刊登了本次发行上市的申请资料。
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Sep
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Sep
China turns away from Nvidia as AI rivalry with US enters a new phase
China’s internet regulator has instructed leading technology firms, including Alibaba Group Holding and ByteDance, to stop buying Nvidia’s artificial intelligence chips.
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Sep
Nvidia, TSMC face antitrust scrutiny as US-China tensions spotlight market power
Just as Washington and Beijing are preparing to resume trade talks, China’s State Administration for Market Regulation (SAMR) has thrown a wrench into the works. The agency accused Nvidia of violating the country’s antitrust laws, putting the company back in the spotlight just months after a controversy over its H20 chips had begun to fade.
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Sep
SK Hynix overtakes Samsung as 2Q25 DRAM revenue surges
Global DRAM shipments saw their sharpest increase in nearly two years during the second quarter of 2025, solidifying SK hynix’s lead over Samsung Electronics. The surge was driven by the rapid expansion of artificial intelligence, with high-bandwidth memory, or HBM, emerging as the key growth engine for the sector.
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Sep
SpaceX advances D2D plans with EchoStar spectrum deal
SpaceX is reportedly working with semiconductor manufacturers to develop a custom chip that will enable its upcoming direct-to-device (D2D) satellite communication service, aimed at connecting ordinary smartphones directly to its Starlink satellite network. The service is slated for testing by the end of 2026, marking a major step in the company’s ambitious plan to reshape global connectivity.
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Sep
Dell Taiwan launches AI Factory 2.0 as enterprise AI adoption advances
Terence Liao, General Manager of Dell Taiwan, said the enterprise AI market has entered a phase of rapid acceleration, with the “flywheel effect” of AI now evident. He noted that more than 80% of businesses are already seeing measurable gains from AI innovation, fueling demand for AI PCs, workstations, servers, and storage systems, which he described as creating an “unlimited pipeline of opportunities.”
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Sep
Hanwha Semitech stakes early lead in hybrid bonding race for SK Hynix’s HBM4
Hybrid bonding machines are set to become critical by 2027, when chipmakers move into mass production of 20-layer, sixth-generation high-bandwidth memory (HBM4). Global equipment suppliers are racing to bring their systems to market ahead of that transition.
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Sep
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California’s Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.