AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation discrete silicon capacitors are set to adopt embedded substrate packaging first, having already entered sample-based process validation, with phased mass production starting from 2026.
Corporate demand for green electricity is accelerating as Taiwan prepares to implement carbon fees in 2026 and as the European Union’s Carbon Border Adjustment Mechanism (CBAM) reshapes export requirements. Data from Taiwan Power Company (Taipower) show that direct supply of green power has risen sharply in recent years, a trend the utility expects to continue as net-zero pressures intensify across supply chains.
As AI workloads reshape data center design, performance is no longer defined solely by computing power. Thermal management has emerged as an equally decisive battleground. Unlike traditional CPU-centric systems, modern AI servers rely heavily on GPUs and specialized accelerators, each drawing hundreds of watts per chip. The resulting thermal density far exceeds the limits of conventional air-cooling, turning heat dissipation into a core infrastructure challenge rather than a peripheral engineering concern.
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