Intel reassigns global fabs, eyes early 14A and EMIB-T AI wins

Intel has accelerated its global footprint reset for 2026 after receiving investments from the US government, SoftBank, and Nvidia. Supply-chain sources said the company has relaunched its worldwide manufacturing sites, pushing ahead with Intel 18A mass production, 14A and high-NA EUV development, and advanced packaging programs including EMIB, EMIB-T, Foveros, and hybrid bonding (HB). The goal is to build an end-to-end manufacturing platform spanning advanced process nodes, chiplets, heterogeneous integration, and backend assembly and testing.

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Tai-Saw leverages frequency-component portfolio to expand into optical communications, LEO satellites and drones

As frequency-control components move toward higher frequencies and smaller form factors, Tai-Saw Technology is leveraging synergies across its diversified product portfolio to expand into optical communications, low Earth orbit (LEO) satellites and drone supply chains. Tight industry capacity and rising raw material costs, however, have extended lead times for some products to 10–12 weeks, prompting the company to gradually expand production.

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ASML supplier Trumpf says South Korea EUV demand is growing faster than Taiwan’s

High-NA EUV lithography is becoming the semiconductor equipment industry’s next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance computing, and mobile devices. Trumpf, a key supplier to ASML, says higher laser power, faster tool output, and closer coordination with chip designers will determine how quickly the technology becomes mainstream.

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