Column: South Korea’s semiconductor strategy faces foresight and structural gaps
Trumpf recalibrates strategy as Chinese competition heats up in semiconductors, machine tools
Global suppliers are facing tougher competition as China’s semiconductor and machine tool industries expand quickly, with implications for customers, pricing, and technology choices worldwide. Germany’s Trumpf says it is responding with innovation in chips and efficiency in machine tools, while trying to stay flexible amid shifting trade and policy risks.
SK Siltron begins liquidating US SiC unit amid Doosan sale talks
China’s AI sector pivots to system-level “super-nodes” as chip curbs bite at WAIC 2026
Anthropic: AI’s edge now lies in delivery, not just model strength
AI development is moving so quickly that companies and regulators worldwide have far less time to adapt, Anthropic said at the 2026 AWS Summit Taipei. For global readers, the shift could shape how businesses deploy automation, compete, and manage risk across finance, healthcare, and other regulated sectors.
Exclusive: SiPearl turns to Taiwan ODMs to bring Rhea-based servers to market
SiPearl has powered on and begun validating Rhea1, its first-generation server CPU designed in Europe. Its next challenge is convincing Taiwan’s server manufacturers to turn the chip into systems that data centers can order and deploy.
China unveils first official commercial space roster, backing established players and the NTN ecosystem
An organization under China’s State Administration of Science, Technology and Industry for National Defense (SASTIND) released the membership list of the National Commercial Space Alliance’s Commercial Space Entrepreneurship Consortium on July 1, offering a rare look at 271 officially recognized space-related organizations. Covering everything from launch services and satellite development to ground infrastructure and financial services, the list signals Beijing’s increasingly institutionalized approach to identifying and supporting established commercial space companies.
TSMC’s CoWoS capacity remains ‘extremely tight’ as OSAT partners ramp expansion
During its July 16 earnings conference, Taiwan Semiconductor Manufacturing Company (TSMC) offered an upbeat outlook on AI demand. Responding to competition from Intel’s EMIB advanced packaging technology, chairman and CEO C.C. Wei said TSMC’s CoWoS capacity remains “extremely tight” and welcomed the emergence of additional advanced packaging solutions to help customers alleviate backend manufacturing bottlenecks.
Taiwan drone sector expands Japanese tie-ups
Taiwan’s drone industry has grown rapidly in recent years, with output surging from about NT$5 billion (US$154.87 million) in 2024 to NT$12.9 billion in 2025, while export value jumped from NT$140 million to NT$2.9 billion. Still, compared with semiconductors and electronics assembly, the drone sector remains small, making it critical for the industry to expand technology cooperation and secure government subsidies.