The AI investment race is building its own bust, BIS paper warns

The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient — and the same contest, financed with debt and circular equity ties, is quietly manufacturing the conditions for a sector-wide bust. That is the central argument of a new Bank for International Settlements (BIS) working paper that puts formal numbers on a warning the institution has been sounding for weeks.

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Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting South Korean industry watchers to call for a shift to a “memory foundry” model. Sungkyunkwan University professor Seokjoon Kwon said at the Nano Korea 2026 forum that memory makers must move from mass production to order-driven design tailored to customer needs.

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Three-tier humanoid robot architecture shift opens edge AI opportunities

The humanoid robot industry is converging on a “big brain, small brain” architecture, with AI compute shifting from the cloud to the edge, and even to hands, feet, and other endpoints. DIGITIMES Intelligence predicts that Nvidia’s CUDA will keep it dominant in the robot “big brain” layer for now, but automotive chipmakers and field-programmable gate array (FPGA) vendors can still target the “small brain” and endpoint edge-compute market to break into the humanoid robot ecosystem.

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Commentary: Samsung, SK Hynix in Washington’s crosshairs over memory fabs

On a recent podcast, DIGITIMES analyst Luke Lin reviewed two major updates in the chip industry: Intel’s Ireland fab expansion and rising US scrutiny of Samsung Electronics and SK Hynix as both South Korean chipmakers expand memory capacity at home. He also assessed whether Intel’s revival is real, saying that its production scale-up and yield will ultimately be the deciding factors.

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JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift

As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates remain widely used, but rising demand for high-density interconnects, lower signal loss, and better dimensional stability is pushing glass substrates closer to commercial adoption.

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Dutch report frames Chinese interference in chips, ports and aerospace as a systemic threat

Chinese foreign interference in the Netherlands’ strategic industries should be treated as a systemic, long-term threat rather than a series of isolated incidents, according to “Beyond Borders,” a report published under the China Knowledge Network (CKN) and written by analysts at the Hague Centre for Strategic Studies (HCSS). The study warns that while individual acts of espionage, coercion, or influence may look manageable on their own, their aggregate effect risks eroding the Netherlands’ technological edge, economic independence, and strategic autonomy.

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