TSMC, Samsung face difficulty in ramping up 3nm chip production

Both TSMC and Samsung Electronics are seeing their production scale for 3nm chips constrained due to difficulty in having good control of orders from big clients, and their capacity utilizations for sub-7nm process nodes are also being affected by the latest US semiconductor trade sanctions against China, according to industry sources. TSMC has moved to encourage its employees to take vacations and spend more time with families, the sources added.

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US new semiconductor export control to hit China AI and supercomputer R&D, says DIGITIMES Research

The US government launched a new series of control of semiconductor export to China earlier in October – the move is expected to limit the country in designing and obtaining high-performance computing (HPC) chips and restrict the technologies to benefit Chinese AI and supercomputer development, preventing their use in strengthening Chinese military and conducting activities in violation of human rights.

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Chiplet mass adoption easier said than done

As the semiconductor industry once again frets over the future of Moore’s Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently featured by Intel as a key driver to its future growth, underpinning the “system foundry” promoted by Intel CEO Pat Gelsinger. At the intel Innovation Forum in late September, leading foundries like TSMC and Samsung even rallied behind Intel, publicly voicing their support for the Universal Chiplet Interconnect Express (UCIe) consortium initiated by Intel to provide an open standard for the interconnects between chiplets. Industry heavyweights including AMD, Arm, Google, TSMC and ASE have all joined the consortium.

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