AUO Digitech showcases clean room-use cleaning robot
AUO Digitech Taiwan showcased its Class 100 cleaning robot specifically for use in clean rooms at Computex 2022.
31
May
31
May
Chipmakers see no cutback in orders for datacenters
TSMC and other chipmakers have seen no cutback in orders for datacenter applications, despite market concerns raised recently about Meta Platforms’ and Google’s potential capex cuts, according to industry sources.
31
May
PWM IC supply for servers remains tight
The supply of server-use power management ICs remains tight, according to industry sources in Taiwan.
31
May
China firm to raise capital to fund SiC substrate capacity
Roshow Technology plans to raise additional funds through a private placement to finance its silicon carbide (SiC) wafer and substrate business.
31
May
Diode, MCU suppliers ramping up for high-speed transmission, HPC, automotive applications
Some Taiwan-based diode and MCU suppliers have extended their chip offerings for niche markets, such as middle- to high-end high-speed transmission, high-performance computing, and automotive applications, and are beginning to realize business benefits.
31
May
Raydium sees promising demand for OLED displays
Display driver IC supplier Raydium Semiconductor has expressed optimism about demand for its OLED DDI chips, which will be increasingly adopted in handsets and other devices.
31
May
Server ODMs remain upbeat about 2022 shipments
Server ODMs remain upbeat about shipments for the rest of this year despite the ongoing shortage of certain chips and components and expect to post high-single-digit or even double-digit shipment growth in 2022, according to industry sources.
31
May
High-end IC testing demand to stay robust in 2H22
Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server device applications, which will fill up related bumping, flip chip ball grid array (FC-BGA), land grid array (LGA), and other advanced packaging capacities through the second half of 2022, according to industry sources.
31
May
群创友达合并传言不断 友达大股东说话了
面板大厂友达与群创的合并传闻不断，身为友达大股东的佳世达董事长陈其宏被问及此事，他直言不便代两公司回应，“面板业是产业重要关键零组件，希望他们愈来愈强，就能握有更明确的定价权。”
31
May