512Gb NAND wafer shortage triggers forced upgrades, narrows gap with 1Tb

The supply landscape for 3D NAND wafers is being structurally reshaped as major manufacturers shift capacity aggressively toward enterprise storage. While output of mainstream 1Tb dies is ramping rapidly, prices for 512Gb TLC wafers have surged. Though 1Tb TLC wafer prices rose to around US$23 in February 2026, the gap with 512Gb wafers has narrowed sharply to below 30%.

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AI startups capture majority of global venture capital in 2025, Best Brokers analysis shows

Artificial intelligence startups drew more than half of global venture capital funding in 2025, marking a significant shift in investor focus toward AI and machine learning companies, according to an analysis by Best Brokers. The report found that AI startups accounted for US$270.2 billion of the US$512.6 billion deployed worldwide, representing 52.7% of total venture capital deal value.

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India advances semiconductor ambitions as TSMC fabricates DLI-backed startup chips

India marked a milestone in its semiconductor push as seven chip designs from startups under the design-linked incentive (DLI) scheme were successfully fabricated, including advanced nodes at Taiwan Semiconductor Manufacturing Co. (TSMC). The progress underscores India’s aim to develop indigenous chip design and manufacturing capabilities amid global supply constraints.

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India reportedly explores linking UPI with China-linked Alipay+ to expand cross-border digital payments

India is in talks with Ant International, the Singapore-based payments firm with roots in China’s Ant Group, to link its Alipay+ cross-border payments platform with India’s Unified Payments Interface (UPI), a move that could significantly expand the overseas usability of India’s dominant digital payments system, two government sources told Reuters.

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AMD’s investment in photonics and modular architecture signals shift in AI infrastructure development

AMD is positioning itself to address the future needs of artificial intelligence (AI) computing through advances in chip design and system architecture, particularly by integrating photonics technology and modular rack-scale platforms. CTO Mark Papermaster, speaking in a recent interview, highlighted how AMD’s evolving engineering strategies will shape AI hardware capabilities and scalability over the next several years.

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As AI goes physical, the robotics supply chain reshuffles

As generative AI expands into physical environments, robotic systems are moving beyond traditional digital roles to interact with their surroundings physically through perception and action. This shift toward Physical AI, supported by Nvidia CEO Jensen Huang’s repeated public endorsements, is reviving global interest in robotics, an industry historically centered on industrial automation. Supply chain players are accelerating strategic efforts to capitalize on this renewed momentum amid an ongoing industry restructuring.

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GlobalFoundries reinvent wafer services by integrating IP to meet evolving market demands

The traditional wafer foundry model is transforming as leading foundries increasingly incorporate intellectual property (IP) into mature technology nodes to address economic pressures and shifting customer needs. Nearly four decades after TSMC founder Morris Chang separated chip design from wafer manufacturing, foundries are evolving from mere silicon suppliers into broader infrastructure providers offering extended platform support.

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