TSMC cautious on High NA EUV as ASML unveils its US$400M chipmaking machine

Kevin Zhang, Deputy Co-Chief Operating Officer at TSMC, recently reiterated the company’s cautious approach toward adopting High NA EUV lithography tools, emphasizing that TSMC is “in no rush” to bring the advanced technology into high-volume production. His remarks have reignited industry speculation around ASML’s multi-billion-dollar next-generation lithography platform.

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GreenRock leads new JV to secure renewable energy supply for Taiwan tech firms

As many Taiwanese technology companies strive to meet international RE100 and net-zero emissions targets, they are increasingly concerned about the long-term challenge of green energy shortages. In response, GreenRock Energy announced on June 4 the launch of a new joint venture, dubbed Yishi Energy, in partnership with Delta Energy and ZN Energy. The goal is to create an investment platform for solar energy projects and strengthen participation in Taiwan’s green power trading market.

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Flytech Technology optimistic about 2H25, focuses on gross margin amid currency surge

Taiwan-based Flytech Technology anticipates a performance in the second quarter of 2025 that will closely mirror the first quarter, excluding the impact of currency exchange rates, according to chairman Tai-seng Lam. Speaking on the company’s outlook, Lam attributed the stable momentum to sustained gains in North America and steady expansion across Europe over the past six months.

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SpaceX eyes FOPLP as Washington pushes chip packaging reshoring

Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The company aims to establish a new advanced packaging factory “built in Texas.” Before the Texas facility becomes operational, orders are currently being handled by STMicroelectronics. Due to strong demand, overflow orders have reportedly been subcontracted to Taiwan’s major panel manufacturer Innolux.

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