AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight. The primary bottleneck stems from continuously expanding chip sizes, which introduce warpage and thermal stress challenges while driving ABF substrate demand to multiply, creating structural supply pressure and underpinning a recovery in 2025 operations for Taiwan’s three leading IC substrate makers.

As artificial intelligence (AI) applications expand, the rising scale and density of server computing have placed a premium on system stability. AI servers, characterized by high costs, extreme power consumption and significant heat generation, face the risk of substantial losses from system outages. This has heightened the importance of baseboard management controllers (BMCs), which provide real-time monitoring of voltage, temperature and system status, driving steady growth in Aspeed Technology’s operating performance.