AMD sees PC growth in 2026 despite market contraction

Advanced Micro Devices (AMD) expects to continue growing its PC business in 2026 even as elevated component prices are projected to weigh on the broader industry, according to comments from CEO Lisa Su on the company’s February 3, 2026, earnings call. During the call, Su detailed a strategy focused on enterprise customers and the premium segment to offset anticipated market headwinds.

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HP CEO Enrique Lores steps down; board names interim leader

HP announced today that Bruce Broussard, who has served on the company’s board of directors since 2021, has been named interim chief executive officer, effective immediately. He succeeds Enrique Lores, who is stepping down as president, CEO, and board member to pursue another professional opportunity. The board has established a CEO search committee and retained a leading global executive search firm to assist in identifying Lores’s permanent successor.

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TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand

Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate efforts to diversify production away from China. The shift is being reinforced by rising electricity consumption from AI data centers, which is driving demand for high-voltage, high-power power management components used in servers and related infrastructure.

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Vanguard International Semiconductor sees strong 2026 AI server power demand

Vanguard International Semiconductor (VIS) forecasts that the semiconductor market in 2026 will be driven primarily by expanding AI investments and applications, which will broadly boost chip demand. At the same time, inventory corrections for commercial, industrial, and automotive chips are gradually returning to healthy levels, strengthening mature process demand.

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Samsung, SK Hynix move into HBM4 as yields and policy risks loom

Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South Korean memory makers for a pivotal contest in 2026 as demand from artificial intelligence accelerators expands. While each company has demonstrated technical readiness, industry participants say yield performance, rather than headline specifications, is likely to determine market share, profitability, and supplier standing in the next phase of the HBM cycle.

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AI drives ODM/EMS growth despite weak consumer electronics in 2025

Global data center investment in 2025 has begun to shift decisively, driven by the rapid expansion of generative artificial intelligence and the growing computational demands of large-scale model training. Spending is moving away from conventional, general-purpose servers toward high-performance computing platforms built specifically for AI training and inference. This transition is ushering the server supply chain into a new phase of structural growth.

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