Hiwin Technologies has spent more than a decade building direct manufacturing and service capacity in South Korea, evolving from component sales to integrated mechatronic solutions and becoming a preferred supplier as semiconductor upgrades and AI-related investment accelerate.

The memory market is no longer just a component story — it is becoming a fault line running through the entire tech industry. As AI infrastructure buildout accelerates, cloud and data-center operators are consuming DRAM and NAND at a pace that is crowding out smartphone makers, distorting foundry economics, and forcing chipmakers to rethink how they secure supply. The consequences are rippling from factory floors in Asia to boardrooms in Silicon Valley.

TSMC is accelerating supplier upgrades and has made growing the share of Taiwan-sourced equipment components a long-term strategic objective. As of February 2026, it had worked with 12 suppliers across 22 continuous improvement processes (CIP) programs, halving validation and development timelines and generating NT$2 billion (US$63.7 million) in annual output value.