TSMC’s gross margin hits 60% in 4Q25 as N2 process set for rapid growth in 2026

TSMC delivered a robust forecast on October 16, projecting its gross margin would climb back to 60% in the fourth quarter and raising its full-year revenue outlook. During an earnings call, Chairman C.C. Wei also announced a significant expansion of the company’s Arizona operations after securing a second large plot of land to accelerate its US growth.

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Shinkong Synthetic Fibers charts new growth paths amid global headwinds, expanding into semiconductors and drones

At the opening of the 2025 Taipei Innovative Textile Application Show (TITAS) on October 14, Tong-sheng Wu, chairman of Shinkong Synthetic Fibers Corporation (SSFC)—a subsidiary of Shinkong Group—addressed the industry’s ongoing challenges, from global tariffs to China’s low-price dumping. Despite this, he maintained an optimistic outlook, remarking, “Business is always tough, but there are always opportunities.”

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Tsinghua University breaks imaging limits with Rafael chip, launching sub-angstrom era

The Department of Electronic Engineering at Tsinghua University (THU) in Beijing has developed the world’s first “sub-angstrom snapshot spectral imaging chip” named Rafael. The research findings were published online in Nature, marking a significant advance in high-precision photonic chips and imaging technology in China. This breakthrough ushers intelligent photonics into an ultra-high resolution era below 0.1 nanometers (sub-angstrom level).

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