Founded in 2010, ZEITEC Semiconductor recently held a pre-listing media briefing to outline its strategy for the mobile phone aftermarket, focusing on display bridge ICs, touch chips, and display driver integration (TDDI) products. The company noted that aftermarket growth has recently outpaced that of new devices. Currently, display bridge ICs developed under an application-specific integrated circuit (ASIC) model are the main revenue driver, enabling screen module makers to recombine different display specifications with phones. ZEITEC holds a dominant position in this segment, accounting for over 50% of the market, thanks to its ASIC-based development favored by customers.

Taiwan-based lead frame manufacturer SDI announced it has signed a right of first offer (ROFO) agreement with Infineon Technologies to jointly advance the development of lead frame technology for artificial intelligence (AI) accelerators and expand into third-generation semiconductor applications, including silicon carbide (SiC) and gallium nitride (GaN), targeting AI processors used in hyperscale data centers.

Google CEO Sundar Pichai recently announced Project Suncatcher, an initiative to deploy the company’s AI computing power via solar-powered satellites in low Earth orbit (LEO). Equipped with Google’s custom Tensor Processing Unit (TPU) chips, these satellites are intended to form a distributed orbital AI data center, enabling scalable AI computation beyond the constraints of terrestrial infrastructure.

Twoway Group announced on November 5, 2025, that Chia-Hsin Tai, formerly the head of sales, has been appointed as the company’s new chief operating officer (COO). Tai will be responsible for operations management, product innovation, strategic planning, and global market expansion within the broadband network sector.