Hanwha Semitech’s SK Hynix TCB deal draws scrutiny over KRW100 billion guarantee

Hanwha Semitech’s supply of thermal compression bonding (TCB) equipment for high-bandwidth memory (HBM) to SK Hynix is drawing scrutiny after the South Korean equipment maker maintained a KRW100 billion (US$66.7 million) performance guarantee since early 2025, raising questions about whether its equipment has fully met the chipmaker’s requirements.

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MediaTek’s Airoha takes on US giants in optical comms DSP chip arena

The expansion of AI data centers is creating new business opportunities that are opening the door for upstarts to challenge industry leaders. A prime example is the four-level pulse amplitude modulation digital signal processing (PAM4 DSP) chip market for optical communications, which is shifting from a duopoly dominated by US leaders Marvell Technology and Broadcom to a more diversified vendor landscape. MediaTek’s subsidiary Airoha is now striving to climb this competitive ladder.

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2026 Hisense U6SF (QD8SF) ULED Mini LED 4K Fire TV series specifications and features

The 2026 Hisense U6SF (QD8SF) series was announced together with the U6SF Pro series on March 9. It is now completely unveiled in the U.S. as the U6SF and in Canada as the QD8SF series. The Hisense U6SF (QD8SF) series comprises six models: Hisense 100U6SF (100QD8SF) – specifications Hisense 85U76SF (85QD8SF) – specifications Hisense 75U6SF (75QD8SF) – specifications Hisense 65U6SF (65QD8SF)…

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2026 Hisense U6SF Pro ULED Mini LED 4K Fire TV series specifications and features

The 2026 Hisense U6SF Pro series was formally announced on March 9. However, Hisense unveiled its full specifications and features this past weekend. The Hisense U6SF (QD8SF) series comprises five models: Hisense 100U6SF Pro – specifications Hisense 85U76SF Pro – specifications Hisense 75U6SF Pro – specifications Hisense 65U6SF Pro – specifications Hisense 55U6SF Pro – specifications The Hisense…

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