Nexperia’s China unit secures local wafer supply under governance dispute

The Chinese subsidiary of Nexperia, the Dutch semiconductor manufacturer, has moved to secure wafer capacity from domestic suppliers to support production of key products in 2026, according to documents reviewed by Reuters. The shift underscores a widening rupture between the China operation and its European parent, as disputes over corporate governance and control continue to reshape the company’s global supply chain.

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TRI’s 2025 operations hit record highs, with advanced packaging opportunities to further drive growth

Optical and electrical inspection equipment supplier Test Research Inc. (TRI) held an online investor conference on December 16, 2025, stating that, benefiting from continued strong demand for networking servers, semiconductors, and automotive electronics, its 2025 revenue is confirmed to hit a record high. The company expects 2026 order momentum to remain strong, significantly reducing the impact of traditional seasonality, with full-year operations expected to continue setting new highs. Gross margin is projected to remain firmly in the 55–60% range.

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Taiwan’s motherboard makers balance AI gains with inflation, PC market headwinds in 2025

Taiwan’s leading motherboard manufacturers—AsusTek, GIGABYTE, Micro-Star International (MSI), and ASRock—have navigated a turbulent global economic environment in 2025 marked by inflation, currency swings, and escalating US-China tensions. While the consumer electronics sector contends with rising costs and shifting demand, these companies have leveraged AI server growth to bolster financial performance amid a shrinking PC DIY market.

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Leading ICT manufacturers compete for foothold in automotive electronics with SDVs on the rise

Major contract electronics makers are accelerating strategic realignments in line with the rapid development of automotive electronics and architectures for software-defined vehicles (SDV). Foxconn has continued to clarify its automotive layout as it expands from full vehicle assembly into core electronics for SDVs, by integrating semiconductors, smart cockpits, battery management systems (BMS), and silicon carbide (SiC) power components into its contract design and manufacturing services (CDMS).

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