As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly leading a market recovery, gradually breaking free from the post-pandemic overexpansion downturn. Despite the rapid market recovery for IC substrates, the short-term problem of T-glass fiberglass shortages remains. Although improvement is expected in the second half of 2026, high-end ABF substrate supply is likely to remain tight until the end of the year, and nearly all customers are facing limitations in sourcing fiberglass.

On February 24, 2026, Taiwan Semiconductor Manufacturing Company (TSMC) crossed the US$2 trillion market capitalization mark, becoming the eighth company in US stock market history to reach the milestone and the first from Taiwan. The achievement places TSMC sixth in the global rankings by market value, behind Nvidia, Apple, Alphabet (Google), Microsoft, and Amazon.

Leading global semiconductor foundry, United Microelectronics Corporation (UMC), has announced on February 25, 2026, a significant restructuring of its executive leadership structure.