The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation’s role in the global chip supply chain.

China’s leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass the 4% threshold in the near term, according to its IPO prospectus and market estimates. The move comes as the company accelerates capacity expansion and technology upgrades to close the gap with industry leaders Samsung Electronics, SK Hynix, and Micron Technology in a market dominated by a handful of suppliers.

Veteran semiconductor equipment distributor Spirox has successfully entered the advanced packaging supply chain in the second half of 2025 with its self-developed advanced optical inspection equipment. Chairman Peter Chin said the product passed foundry customer validation and secured the first order for a non-destructive through-silicon via (TSV) inspection system, slated for shipment and revenue contribution in the first half of 2026. This milestone marks the group’s transition into a new business phase.