AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation discrete silicon capacitors are set to adopt embedded substrate packaging first, having already entered sample-based process validation, with phased mass production starting from 2026.
At the HAIC2025 Artificial Intelligence Innovation Conference in Kunshan on December 18, Dawning Information Industry Co. (Sugon) unveiled its scaleX 10,000-accelerator supercluster, marking the first physical debut of a domestically developed AI cluster at this scale.
AMEC, China’s leading semiconductor equipment vendor, has sent its clearest signal yet that it no longer intends to remain a single-discipline specialist. Its planned acquisition of a controlling stake in Hangzhou Sizone Electronic Technology marks a strategic shift toward becoming a platform-scale equipment group, rather than a company defined by individual tools.
Corporate demand for green electricity is accelerating as Taiwan prepares to implement carbon fees in 2026 and as the European Union’s Carbon Border Adjustment Mechanism (CBAM) reshapes export requirements. Data from Taiwan Power Company (Taipower) show that direct supply of green power has risen sharply in recent years, a trend the utility expects to continue as net-zero pressures intensify across supply chains.
Eternal Precision Mechanics, a subsidiary of LCY Technology (Eternal Materials), has quietly become one of the most dominant players in the global semiconductor equipment supply chain.
Rafael Microelectronics is positioning optical communications and custom ASIC services as the twin pillars of its growth strategy heading into 2026, as the company accelerates its transition from a niche receiver-chip supplier into a broader high-speed signal transmission solutions provider.
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