Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity

Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity to internal production, according to Hankyung and industry sources. The move underscores the South Korean chipmaker’s drive to meet surging demand for artificial intelligence (AI) components as orders from major customers — including Nvidia and Advanced Micro Devices (AMD) — continue to accelerate.

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Research Insight: AI reshapes Taiwan’s PCB industry around high-end capacity and materials

DIGITIMES observes that as demand surges for AI servers, high-speed switches, optical communication modules, and edge AI devices, Taiwan’s PCB industry is undergoing a structural shift in its growth model. The traditional cyclical, recovery-driven growth is giving way to competition centered on high-end capacity deployment, control of critical materials, and global expansion capabilities.

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Experts urge expanded national guarantees as Taiwan offshore wind round 3.3 faces rising financing pressure

As Taiwan enters round 3.3 of its offshore wind development project, foreign financial institutions have reached relatively high exposure levels. Experts say Taiwan’s government should expand its financing guarantee mechanisms to boost banks’ willingness to participate in lending, and encourage greater involvement from public banks to address the gaps in financing capacity among both domestic and international lenders.

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