US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth memory (HBM), and advanced packaging, driving higher process control intensity, while supply constraints and cost pressures remain ongoing risks.
According to a recent report from Counterpoint Research, the Apple iPhone 16 finished 2025 as the world’s best-selling smartphone, topping global sales ahead of all other models. The iPhone 16’s strong performance capped a remarkable year for Apple, which claimed seven out of the top ten best-selling smartphone models worldwide. Only Samsung’s devices filled the remaining three positions, underscoring a duopoly at the top of the market that has held steady for several years.
AI server architectures are rapidly shifting toward ultra-high-density designs, keeping advanced CoWoS packaging capacity persistently tight. The primary bottleneck stems from continuously expanding chip sizes, which introduce warpage and thermal stress challenges while driving ABF substrate demand to multiply, creating structural supply pressure and underpinning a recovery in 2025 operations for Taiwan’s three leading IC substrate makers.
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