Defense chips, satellite systems now “100% localized,” Chinese academics say

As conflict in the Middle East intensifies and geopolitical risks rise, governments worldwide are paying closer attention to the resilience of defense supply chains and semiconductor self-sufficiency. Against this backdrop, and as China convenes its annual “Two Sessions,” an article jointly authored by several Chinese academicians and published in the state-backed journal Science & Technology Review has drawn attention.

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Broadcom CEO sees copper interconnects viable through 2028

Broadcom reported strong results for the first quarter of fiscal 2026, driven by robust demand for cloud application-specific integrated circuits (ASICs), and issued an upbeat outlook. During the earnings call, however, industry attention centered less on the company’s financial performance and more on its views on silicon photonics and copper interconnect technologies.

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Tier-1 orders from major automakers fueling growth for Hiroca

The Chinese automotive market is undergoing an unprecedented transformation amid increasing industry volatility. As new energy vehicle (NEV) penetration rapidly rises, the traditional internal combustion engine (ICE) segment continues to shrink. Coupled with ongoing price wars, automakers face fierce competition on retail pricing while imposing stricter cost controls and faster R&D demands on their supply chains.

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DynaPack plans triple BBU capacity expansion to meet AI data center demand

With AI data centers now integrating battery backup units (BBU), battery module maker DynaPack plans to add an additional 200% to its production capacity at its Taiwan and Thailand facilities to capitalize on this clearly emerging trend, with room for further growth. In addition, the company has several ongoing projects to develop BBUs tailored for high-voltage direct current (HVDC) systems, targeting mass production as early as 2027.

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