German government approves TSMC’s Dresden fab financing plan

The Federal Ministry for Economic Affairs and Climate Action of Germany (BMWK) has officially approved financing for TSMC’s wafer fab project in Dresden. The German government has signed an agreement with the four companies co-investing in European Semiconductor Manufacturing Company (ESMC) – TSMC, Bosch, Infineon, and NXP. On December 13, Germany’s Federal Minister for Economic Affairs Robert Habeck formally announced the launch of this joint investment project.

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AI boom drives networking supply chain growth

The explosive growth in AI adoption has created opportunities beyond traditional computing sectors, with networking suppliers emerging as major beneficiaries. While Broadcom, a leader in wireless networking chips and prominent ASIC provider, gains attention for its AI ASIC growth, Taiwan-based networking switch makers like Accton and Senao Networks are discovering new growth avenues through AI servers.

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